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Description
Features
- SMART DESIGN
New technical support, unique chemical formula provides excellent wetting, to ensure high reliability.Adapted to the mobile phone repair industry, computer digital service industries and high-presicion circuit board soldering SMT/BGA soldering processes.
- PCB/BGA DEDICATED
High-end quality, a unique formula, perfect performance, easy to weld, solder joint is bright and full, no weld, false welding phenomenon.
- WIDELY APPLICABLE
The residue is colorless and transparent, does not affect t he detection, disposable and excellent cleaning performance. Use of efficient energy thixotropic agents, printing and preheating collapse, special solder ensure a good printing and fine pattern.
- REVOLUTIONARY DURABILITY
Wetting, anti-dry, relatively long shelf life at room temperature. Unique high-quality solder paste, fine and flexible packaging (10 cc/support), delicate appearance.
Preservation method:
- The solder paste should be kept at 1-10℃.
- Before the opening, the temperature of the solder paste should be raised to the ambient temperature (25℃), and the temperature return time should be about 3-4 hours.
- The solder paste should be used for 6 months.
- The solder paste should not be placed in the sun.
Precautions:
- Use only with adequate Ventilation.
- The solder paste contains organic solvent. Avoid repeated contact with skin. If the solder paste gets on your skin, wipe it off with alcohol and rinse thoroughly with water.
- Avoid contacting with eyes.
- Keep away from children.
Specifications:
- Volume: 10 ml
- Size: 4.13*1.38 inch
- Working Temperature: 240℃
Package includes:
- 1 * BGA Syringe Tin Solder Paste
